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PCB Assembly

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Automated Assembly
Automated Assembly
Automated Assembly
  Mixed Technology PCA
Mixed Technology PCA
Mixed Technology PCA
  Quality PCA Manufacturing
Quality PCA Manufacturing
Quality PCA Manufacturing

The printed circuit board (PCB) is at the very heart of your product. So when it comes to printed circuit assembly (PCA), you want only the highest standards of quality and precision. BTW maintains these high standards through an unwavering attention to detail. We have the most thorough manufacturing and testing processes in place to ensure that every board is nothing short of perfect. And we continually seek new ways to improve those processes. While the PCB is at the heart of your product, printed circuit assembly is at the heart of our service. Together we will realize the results you are looking for.

Our solutions include surface mount (SMT), through-hole (PTH) and mixed technology assemblies. Our SMT lines consist of fully automatic, vision screen printers, multifunctional high-speed Juki placement machines, automated optical inspection (AOI) and seven zone convection reflow ovens. These Juki lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki technicians. You just won't experience down time!

Programmable robotic selective solder, wave solder machines and proven expertise developing custom tooling result in a complete suite of capabilities delivering all of your printed circuit assembly requirements. With BTW our matrix of high tech equipment, advanced processes and skilled personnel provide the high quality, low costs and consistent on-time delivery you wish to enjoy.

 

General Capabilities Surface Mount
Mixed Technology
Through Hole
Lead and Lead Free
Clean and No-Clean
Single Sided Population
Double Sided Population
Circuit Board Construction Rigid
Flexible
Combined Construction (Rigid and Flex)
Single and Multilayer
Board Thickness
Min
0.4mm
0.015"
Max
4mm
0.157"
PCB Panel Size
Min
50.8mm x 50.8mm
2" x 2"
Max
410mm x 360mm
16.14" x 14.17"
Component Size
0201 and Larger
01005 Capable
Lead Pitch
0.3mm
0.011"
Max
3mm
0.118"
Processes
Screen Printing
  • Lead or Lead Free
  • EdgeLoc Board Clamping
  • Auto Pin Placement
  • Closed-loop Print Head
  • Squeegee Compliance Routine
  • Quick Change Stencil Wiper
  • Solvent Delivery Method
  • 2D Inspection Capable
Pick and Place
  • SMT
    • 0201 and larger
    • 11 Mil Pitch and up
    • BGA and Micro BGA
Through-hole
  • Component Lead Forming
  • Axial Component Sequencing
  • Manual/Mechanical Assembly
Soldering
  • Lead or Lead Free
  • Wave
  • Reflow
  • Selective / Robotic
  • Hand Soldering
  • PTH & Mixed Technology
Depaneling
  • Nibbler
  • Shear
  • V-Score
  • Router
Cleaning
  • Aqueous Cleaning
    • Closed Loop De-Ionized Wash
    • Chemical Clean
Conformal Coating
  • Dip, Manual, Aerosol, Non-Aerosol
  • Acrylic, Silicon, Urethane
Inspection
  • 2D Automated Solder Paste
  • SMT Placement
  • AOI – Automated Optical Inspection
  • Real Time X-Ray Imaging
  • Ersa Scope Flip Chip & BGA Inspection
    • Digital & Optical Zoom
    • Imaging
  • Ionic Contamination Testing
Test
  • ICT
  • Functional
  • Flying Probe
ESS – Environmental Stress Screening
  • 24" x 24" x 24"
  • -70° to +170°
Production Volume
Min: 1 unit Max: Hundreds of Thousands of units

Prototypes
New Product Introduction (NPI)
Production
Post Production
High Mix Low Volume
High Volume Low Mix


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