Assembly & Integration
Specialties:
Surface Mount Technology - SMT
Through Hole Technology - THT
Mixed Technology
Leaded, Lead Free, Water Soluble and No-clean Solder Applications
Printed Circuit Board (PCB) are traditionally designed at the heart of your products. When it comes time to select a Contract Manufacturer to partner with on something so delicate you should expect the highest standards of quality and precision. At BTW we focus on executing your design by maintaining thorough manufacturing and testing processes to ensure your finite details are met. As a BTW customer we commit to partner with you in providing you with both quality product and exceptional service. Historically, these commitments have proven profitable for many BTW customers. PCB Assembly is the heart of BTW’s business platform. If your PCB is the heart of your design, BTW is the right place for you.
BTW specializes in Surface Mount Technology (SMT), Plated Thru-Hole (PTH), and Mixed Technology assemblies. Our SMT lines consist of fully automatic vision screen printers, multifunctional high-speed Juki placement machines, Automated Optical Inspection (AOI) and thirteen zone convection reflow ovens. Our Juki SMT lines offer a high level of flexibility and throughput enhanced by the on-staff support of two former Juki field service Engineers. Our manufacturing team has over 25 years of Thru-Hole and Mixed Technology placement experience. BTW’s suite of advanced technologies in programmable robotic selective solder and wave solder paired with our experienced hand solder technicians and our tooling and test development expertise can deliver all of your Printed Circuit Board Assembly (PCA) needs in one convenient location.
Board Thickness: 0.015 - 0.157 inches (0.4 - 4mm)
“Standard” PCB Panel Size: 2.0 x 2.0 inches - 31.50 x 16.14 inches (50.8 x 50.8 - 800 x 410mm)
* BTW is capable of running larger than standard dimensions with proper tooling development
Component Size: 01005 and Larger
Lead Pitch: 0.011 - 0.118 inches (0.3 - 3mm)
Process Control - Aegis Manufacturing Software
Barcoded Work In-Progress (WIP) tracking
Product Traceability
On-line Defect Collection
Bill of Material Management
Machine Programming
Quality Reporting
CAD Data Importation
Screen Printing
Lead, Lead Free, Water Soluble and No-clean processing
EdgeLoc Board Clamping
Auto Pin Placement
Closed-loop Print Head
Squeegee Compliance Routine
Quick Change Stencil Wiper
Solvent Delivery Method
2D Inspection Capable
Pick and Place
SMT - Surface Mount Technology
01005 and larger
11+ Mil Pitch
BGA and Micro BGA
Cleaning
Aqueous Cleaning
Closed Loop De-Ionized Wash
Chemical Clean
Inspection
2D Automated Solder Paste
SMT Placement
AOI - Automated Optical Inspection
Real Time X-Ray Imaging
Ersa Scope Flip Chip and BGA Inspection
Test
ICT - In Circuit Testing
Functional Testing
Through-hole
Component Lead Forming
Manual/Mechanical Assembly
Soldering
Lead, Lead Free, Water Soluble and No-clean
Solder
Wave
Reflow
Selective / Robotic
Hand Soldering
PTH & Mixed Technology
Depaneling
Nibbler
Shear
V-Score
Router
Production Capacity
Minimum: 1 Unit
Maximum: Hundreds of Thousands of units
High Mix Low Volume
High Volume Low Mix
Prototypes
New Product Introduction (NPI)
Production
Post Production